FOL Process Engineer

Join Coherent as a FOL Process Engineer and play a pivotal role in sustaining and enhancing our Die Attach & Wire Bond processes. This is a unique opportunity to contribute to cutting-edge electronics manufacturing in a dynamic and innovative environment. You will work closely with a team of experts to optimize and improve our production processes, ensuring the highest quality and efficiency standards.

Based in the beautiful city of Canggu, you will be part of a global company with a strong presence in the electronics industry. Coherent is known for its commitment to innovation and excellence, making it an ideal place to grow and develop your career. In this role, you will have the chance to work with state-of-the-art equipment and cutting-edge technology, such as the ASM EDA 2500 and the Kulicke & Soffa 8400.

As a FOL Process Engineer, you will be responsible for maintaining and improving our Die Attach and Wire Bond processes. You will work closely with the production team to ensure that our products meet the highest quality standards. This role offers a competitive salary and a comprehensive benefits package, including health insurance, retirement plans, and opportunities for professional development.

📋 Tanggung Jawab Pekerjaan

• Monitor and maintain Die Attach and Wire Bond processes to ensure optimal performance and quality.
• Conduct process improvements and optimizations to enhance efficiency and reduce waste.
• Troubleshoot and resolve process issues, working closely with the production team.
• Develop and implement standard operating procedures (SOPs) for Die Attach and Wire Bond processes.
• Collaborate with cross-functional teams to drive continuous improvement initiatives.
• Conduct root cause analysis and implement corrective actions to prevent recurrence of issues.
• Ensure compliance with industry standards and regulations.
• Provide technical support and training to the production team.

🎓 Kualifikasi & Syarat

• Bachelor's degree in Chemical Engineering, Mechanical Engineering, or a related field.
• Minimum of 5 years of experience in semiconductor or electronics manufacturing, with a focus on Die Attach and Wire Bond processes.
• Strong understanding of semiconductor manufacturing processes and equipment.
• Experience with ASM EDA 2500 and Kulicke & Soffa 8400 equipment.
• Knowledge of statistical process control (SPC) and Six Sigma methodologies.
• Certification in Lean Manufacturing or a related field is a plus.
• Excellent problem-solving and analytical skills.
• Strong communication and teamwork skills.

🛠️ Keahlian

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